The US semiconductor company has commenced construction on a new high-bandwidth memory advanced packaging facility.

Micron Technology revealed a plan to invest $7 billion for a new high-bandwidth memory (HBM) packaging plant in Singapore.

Micron Technology, Inc. (NASDAQ:MU) broke ground on a new High-Bandwidth Memory (HBM) advanced packaging facility near the ...

Micron Technology (MU) said it broke ground on a new High-Bandwidth Memory, or HBM, advanced packaging facility in Singapore.

Operations are scheduled to start in 2026 with the expansion of packaging capacity beginning in 2027. Read more at ...

Micron Technology Inc. is investing $7 billion over the next several years to expand its manufacturing footprint in Singapore ...

It's Singapore's first facility dealing with HBM, part of the AI chips that's powering companies like Nvidia and TSMC to new ...

Micron Technology is investing $7 billion to build an advanced chip packaging facility in Singapore as the semiconductor ...

Hankook Semiconductor, which holds the world's number one market share in TC bonders, began supplying Micron in April 2024, ...

Micron Technology initiated construction on (January 8, 2025) of a new High-Bandwidth Memory (HBM) advanced packaging ...

Just over two years ago, Micron Technology announced it would build, with substantial help from taxpayers, the nation’s ...